Apparatus and methods for enhancing thermal performance of integrated circuit packages
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United States of America Patent
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Apr 27, 2004
Grant Date -
Sep 11, 2003
app pub date -
Mar 8, 2002
filing date -
Mar 8, 2002
priority date (Note) -
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Abstract
Novel methods and apparatus to enhance thermal performance of IC packages are disclosed. In an embodiment, a method of enhancing thermal uniformity across a semiconductor device is disclosed. The method includes providing the semiconductor device. The semiconductor device has a plurality of thermal regions. A first thermal region of the plurality of thermal regions has a different temperature than a second thermal region of the plurality of thermal regions. The method further provides a thermal enhancement material substantially adjacent to the first and second thermal regions. In another embodiment, a thermal conductivity of the thermal enhancement material is adjusted in relation to a temperature effecting the thermal enhancement material.
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