Semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 27, 2004
Grant Date -
Oct 17, 2002
app pub date -
Sep 17, 2001
filing date -
Apr 12, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The semiconductor device comprises a lead frame including a die pad portion for mounting a semiconductor element thereon and a board mounting portion for mounting a circuit board thereon, and a sealing resin for sealing the semiconductor element, the circuit board, the die pad portion and the board mounting portion. The lead frame further includes an anchoring region having a higher anchoring effect for the resin than that of each of the die pad portion and the board mounting portion between at least the die pad portion and the board mounting portion. The anchoring region enhances the adhesion of a sealing resin to a lead frame, to prevent the crack of a semiconductor device to be mounted on the lead frame and the disconnection of a bonding wire.
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