Method for making a sonoprobe
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United States of America Patent
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-
May 4, 2004
Grant Date -
Sep 19, 2002
app pub date -
Jul 7, 1999
filing date -
Nov 7, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A process for the fabrication of a multielement acoustic probe. A flexible circuit having conducting tracks on at least one of its sides is used. This circuit is joined to a plate of piezoelectric material having metallizations. Vias are produced through the flexible circuit in order to address the metallizations and to produce electrical contacts within the vias. This process may be used in echography probes.
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