Multi-chip module system and method of fabrication
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United States of America Patent
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May 4, 2004
Grant Date -
May 2, 2002
app pub date -
Dec 28, 2001
filing date -
Mar 12, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Multi-chip module systems and method of fabrication thereof wherein the equivalent of a failed die of a multi-chip module (MCM) is added to the module in a vacancy position previously constructed with appropriate electrical connections. A variety of different dice may be attached to the same vacancy position of an MCM by means of adapters, wherein each adapter has the same footprint, but different adapters are capable of accommodating different numbers and types of dice.
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