Semiconductor light emitting element formed on a clear or translucent substrate
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United States of America Patent
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May 4, 2004
Issued Date -
N/A
app pub date -
Nov 25, 2002
filing date -
Sep 12, 2000
priority date (Note) -
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Abstract
This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contact pads leading to a circuit board. The conductors are deposited on the substrate using thin film technology. Preferably the light emitting element is packaged in a flip chip having connecting bumps only on one side.
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