Stackable semiconductor package and method for manufacturing same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 4, 2004
Grant Date -
N/A
app pub date -
Oct 13, 2000
filing date -
Dec 20, 1999
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A stackable semiconductor package having a lead frame, a plurality of electrical paths, and a sealing material. The leadframe has a plurality of leads, each one of the plurality of leads having a top portion exposed to a top surface of the semiconductor package and a bottom portion resting flush with a bottom surface of the semiconductor package. In this manner, the leads extending from the top surface to the bottom surface of the semiconductor package provide an electrical path for connecting and electrically powering a second semiconductor package stacked on top of a first bottom semiconductor package.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully