Interdigitated capacitor design for integrated circuit lead frames and methods
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 4, 2004
Issued Date -
N/A
app pub date -
Aug 27, 2002
filing date -
Apr 1, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device includes a two-part, coplanar, interdigitated decoupling capacitor formed as a part of the conductive lead frame. For down-bonded dice, the die attach paddle is formed as the interdigitated member. Alternatively, an interdigitated capacitor may be placed as a LOC type lead frame member between electrical bond pads on the die. The capacitor sections comprise Vcc and Vss bus bars.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully