Integrated circuit mounting system with separate loading forces for socket and heat sink
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United States of America Patent
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May 4, 2004
Grant Date -
N/A
app pub date -
Dec 20, 2002
filing date -
Dec 20, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A mounting system for an integrated circuit employs a novel load cell having a backing plate, a bow spring and a load distribution plate. The load cell controls the loading forces on contacts of an integrated circuit socket. A heat sink having a base includes a pedestal extending from the base that abuts the integrated circuit for purposes of heat removal. Springs are employed to provide loading forces for the heat sink that are lower than the loading forces for the integrated circuit socket contacts.
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