Carrier for printhead assembly including fluid manifold and isolation wells for electrical components
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United States of America Patent
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May 11, 2004
Issued Date -
N/A
app pub date -
Oct 30, 2002
filing date -
Aug 25, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printhead assembly includes a substrate having a first side and a second side opposite the first side, at least one electrical component mounted on the second side of the substrate, a substructure having a fluid manifold and at least one well isolated from the fluid manifold defined therein, and a plurality of printhead dies each mounted on the first side of the substrate. The substructure is disposed on the second side of the substrate such that the at least one electrical component is confined within the at least one well.
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