Integrated circuit package

United States of America Patent

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May 11, 2004
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Mar 12, 2003
filing date
Dec 18, 1998

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Abstract

An integrated circuit package is disclosed. According to one embodiment of the present invention an integrated circuit is formed in a die having an edge, and a plurality of non-I/O columns are bonded between a substrate and the die a selected distance from the edge of the die.

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Patent Owner(s)

Patent Owner	Address
INTEL CORPORATION	2200 MISSION COLLEGE BLVD SANTA CLARA CA 95054

International Classification(s)

H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Seshan, Krishna	San Jose, CA	63	991
Yan, Soupin	San Jose, CA	2	19

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Integrated circuit package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10387046

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US Family Size	Non-US Coverage
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DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 11, 2004	US,6734544,B2 US6734544B2	GRANTED PATENT AS SECOND PUBLICATION
August 21, 2003	US,20030155640,A1 US20030155640A1	FIRST PUBLISHED PATENT APPLICATION

PATENT NO	6734544
SERIAL NO	10387046
DOCKET NO

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10387046

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