Thermal management apparatus for horizontal electronics enclosures
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United States of America Patent
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May 11, 2004
Grant Date -
N/A
app pub date -
May 27, 2003
filing date -
May 27, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A reconfigurable apparatus for thermal management of an electronics module is described. The apparatus includes a pair of fans generating airflow along respective fan axes. The apparatus also includes a beat sink having one portion disposed in the airflow of the fans and another portion adapted for thermal coupling with the electronics module. The airflows from the fans are in the same direction when the apparatus is arranged in a front-to-back airflow configuration and the airflows are in opposite directions when the apparatus is arranged in a front-to-front airflow configuration. A removable flow director is included in the apparatus when the apparatus is in the front-to-front airflow configuration to direct the airflow from the first fan towards the second fan.
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