Curable resin composition
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United States of America Patent
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May 18, 2004
Grant Date -
N/A
app pub date -
Nov 20, 2001
filing date -
Feb 5, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is to provide a curable resin composition comprising (I) a reactive silicon group-containing polyoxyalkylene polymer wherein a introduction rate of a reactive silicon group into molecular chain terminus is not less than 85% as analyzed by .sup.1 H-NMR spectrometry and (II) an epoxy resin. The curable resin obtained from this composition reflects improvements in tensile strength and tensile shear bond strength and in adhesion to various substrates.
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