US Patent No: 6,737,750

Number of patents in Portfolio can not be more than 2000

Structures for improving heat dissipation in stacked semiconductor packages

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Abstract

Semiconductor packages including at least two semiconductor dies are disclosed. A first die is mounted on a substrate, which may be a metallized laminate or a leadframe. A rigid support structure is mounted on the substrate over the first die. The support structure may be thermally coupled to the substrate, and also may be electrically coupled to the substrate. A second die is mounted on the support structure, which spaces the second die away from the first die. Encapsulant fills the volume within the support structure, including the vertical space between the pair of dies. In an alternative package embodiment, a heat spreader formed of a flexible metal sheet may be thermally coupled between the two stacked dies. The heat spreader transfers heat from the first and second dies to a heat sink of the substrate. The support structure and the heat spreader mitigate the transfer of heat between the first and second dies.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
AMKOR TECHNOLOGY, INC.CHANDLER, AZ734

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoffman, Paul Robert Chandler, AZ 11 363
Zoba, David Albert Chandler, AZ 3 158

Cited Art

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (9)
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5,721,452 Angularly offset stacked die multichip device and method of manufacture 80 1995
5,689,135 Multi-chip device and method of fabrication employing leads over and under processes 179 1995
5,696,031 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice 127 1996
6,080,264 Combination of semiconductor interconnect 101 1997
5,973,403 Device and method for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice 139 1997
5,886,412 Angularly offset and recessed stacked die multichip device 72 1997
6,051,886 Angularly offset stacked die multichip device and method of manufacture 130 1998
6,214,641 Method of fabricating a multi-chip module 125 1999
 
NATIONAL SEMICONDUCTOR CORPORATION (4)
5,422,435 Stacked multi-chip modules and method of manufacturing 284 1992
5,502,289 Stacked multi-chip modules and method of manufacturing 188 1995
5,495,398 Stacked multi-chip modules and method of manufacturing 216 1995
5,739,581 High density integrated circuit package assembly with a heatsink between stacked dies 107 1995
 
ROUND ROCK RESEARCH, LLC (3)
5,291,061 Multi-chip stacked devices 196 1993
5,323,060 Multichip module having a stacked chip arrangement 313 1993
RE36613 Multi-chip stacked devices 180 1996
 
FUJITSU LIMITED (2)
5,463,253 Semiconductor device having a plurality of chips 100 1994
5,656,864 Semiconductor device having upper and lower package bodies and manufacturing method thereof 39 1996
 
SHARP KABUSHIKI KAISHA (2)
5,793,108 Semiconductor integrated circuit having a plurality of semiconductor chips 56 1996
6,072,243 Semiconductor integrated circuit device capable of surely electrically insulating two semiconductor chips from each other and fabricating method thereof 103 1997
 
AVAYA INC. (1)
5,530,202 Metallic RF or thermal shield for automatic vacuum placement 36 1995
 
EASTMAN KODAK COMPANY (1)
5,136,323 Apparatus for enhancing heat and mass transfer in a fluid medium 21 1990
 
FREESCALE SEMICONDUCTOR, INC. (1)
5,166,772 Transfer molded semiconductor device package with integral shield 110 1991
 
H.G. WEBER & CO., INC. (1)
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HONEYWELL INC. (1)
6,005,778 Chip stacking and capacitor mounting arrangement including spacers 146 1996
 
IDEMITSU KOSAN CO., LTD. (1)
5,013,665 Method for regenerating deactivated microorganisms 20 1988
 
INTEL CORPORATION (1)
5,815,372 Packaging multiple dies on a ball grid array substrate 126 1997
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
6,326,696 Electronic package with interconnected chips 64 1998
 
KABUSHIKI KAISHA TOSHIBA (1)
5,715,147 Semiconductor device having an interconnecting circuit board 48 1996
 
MINNESOTA MINING AND MANUFACTURING COMPANY (1)
5,866,949 Chip scale ball grid array for integrated circuit packaging 194 1997
 
NXP B.V. (1)
6,057,598 Face on face flip chip integration 128 1997
 
RENESAS ELECTRONICS CORPORATION (1)
5,347,429 Plastic-molded-type semiconductor device 65 1993
 
ROHM CO., LTD. (1)
6,133,637 Semiconductor device having a plurality of semiconductor chips 148 1998
 
SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY (1)
5,200,809 Exposed die-attach heatsink package 204 1991
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
5,365,107 Semiconductor device having tab tape 36 1993
 
SILICONWARE PRECISION INDUSTRIES CO., INC. (1)
6,429,512 Ball grid array integrated circuit package with palladium coated heat-dissipation device 12 2000
 
SILICONWARE PRECISION INDUSTRIES CO., LTD. (1)
6,246,115 Semiconductor package having a heat sink with an exposed surface 72 1999
 
TEXAS INSTRUMENTS INCORPORATED (1)
5,025,306 Assembly of semiconductor chips 125 1988
 
OTHER [CHECK PATENT PROFILE FOR ASSIGNMENT INFORMATION] (1)
4,763,188 Packaging system for multiple semiconductor devices 199 1987

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
CHIPPAC, INC. (25)
7,205,647 Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages 16 2003
7,064,426 Semiconductor multi-package module having wire bond interconnect between stacked packages 54 2003
7,053,476 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages 46 2003
6,972,481 Semiconductor multi-package module including stacked-die package and having wire bond interconnect between stacked packages 63 2003
6,838,761 Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield 91 2003
7,053,477 Semiconductor multi-package module having inverted bump chip carrier second package 42 2003
7,049,691 Semiconductor multi-package module having inverted second package and including additional die or stacked package on second package 46 2003
7,045,887 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package 48 2003
6,933,598 Semiconductor stacked multi-package module having inverted second package and electrically shielded first package 64 2003
6,906,416 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package 69 2003
7,101,731 Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package 40 2005
7,671,451 Semiconductor package having double layer leadframe 15 2005
7,288,434 Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package 7 2006
7,247,519 Method for making a semiconductor multi-package module having inverted bump chip carrier second package 16 2006
7,166,494 Method of fabricating a semiconductor stacked multi-package module having inverted second package 14 2006
7,682,873 Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages 0 2006
7,279,361 Method for making a semiconductor multi-package module having wire bond interconnect between stacked packages 5 2006
7,169,642 Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package 17 2006
8,030,134 Stacked semiconductor package having adhesive/spacer structure and insulation 1 2006
7,351,610 Method of fabricating a semiconductor multi-package module having a second package substrate with an exposed metal layer wire bonded to a first package substrate 3 2007
7,364,946 Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package 8 2007
7,358,115 Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sides 3 2007
8,143,100 Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages 0 2007
7,749,807 Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies 0 2007
7,935,572 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages 1 2010
 
STATS CHIPPAC LTD. (24)
7,061,088 Semiconductor stacked multi-package module having inverted second package 56 2003
7,057,269 Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package 46 2003
7,253,511 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package 28 2004
7,768,125 Multi-chip package system 4 2006
7,750,482 Integrated circuit package system including zero fillet resin 0 2006
7,429,786 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides 38 2006
7,429,787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides 22 2006
7,372,141 Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides 33 2006
7,829,986 Integrated circuit package system with net spacer 1 2006
7,582,960 Multiple chip package module including die stacked over encapsulated package 1 2006
7,394,148 Module having stacked chip scale semiconductor packages 14 2006
7,692,279 Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package 2 2007
7,687,313 Method of fabricating a semiconductor multi package module having an inverted package stacked over ball grid array (BGA) package 5 2008
7,687,315 Stacked integrated circuit package system and method of manufacture therefor 2 2008
7,855,100 Integrated circuit package system with an encapsulant cavity and method of fabrication thereof 3 2008
7,645,634 Method of fabricating module having stacked chip scale semiconductor packages 1 2008
7,652,376 Integrated circuit package system including stacked die 4 2008
8,039,316 Integrated circuit packaging system with stacked integrated circuit and heat spreader with openings and method of manufacture thereof 0 2009
8,018,040 Shielded stacked integrated circuit packaging system and method of manufacture thereof 2 2009
7,829,382 Method for making semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package 0 2010
8,021,924 Encapsulant cavity integrated circuit package system and method of fabrication thereof 2 2010
8,368,200 Shielded stacked integrated circuit packaging system and method of manufacture thereof 0 2011
8,309,397 Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof 0 2011
8,227,925 Integrated circuit packaging system with interposer 0 2012
 
MICRON TECHNOLOGY, INC. (13)
7,332,819 Stacked die in die BGA package 4 2002
7,371,608 Method of fabricating a stacked die having a recess in a die BGA package 6 2003
7,344,969 Stacked die in die BGA package 3 2003
7,332,820 Stacked die in die BGA package 4 2003
7,282,390 Stacked die-in-die BGA package with die having a recess 3 2006
7,358,117 Stacked die in die BGA package 3 2006
7,309,623 Method of fabricating a stacked die in die BGA package 7 2006
7,282,392 Method of fabricating a stacked die in die BGA package 3 2006
7,781,877 Packaged integrated circuit devices with through-body conductive vias, and methods of making same 3 2007
7,799,610 Method of fabricating a stacked die having a recess in a die BGA package 3 2007
7,575,953 Stacked die with a recess in a die BGA package 2 2007
8,373,277 Stacked die in die BGA package 0 2008
8,212,348 Techniques for packaging multiple device components 0 2010
 
BROADCOM CORPORATION (11)
7,550,845 Ball grid array package with separated stiffener layer 3 2002
7,482,686 Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same 16 2004
7,432,586 Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages 11 2004
7,582,951 Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages 43 2005
8,183,680 No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement 0 2006
7,808,087 Leadframe IC packages having top and bottom integrated heat spreaders 42 2006
7,714,453 Interconnect structure and formation for package stacking of molded plastic area array package 13 2007
8,183,687 Interposer for die stacking in semiconductor packages and the method of making the same 1 2007
7,872,335 Lead frame-BGA package with enhanced thermal performance and I/O counts 1 2007
7,791,189 Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same 1 2009
7,781,266 Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages 41 2009
 
FAIRCHILD SEMICONDUCTOR CORPORATION (4)
7,439,613 Substrate based unmolded package 13 2004
7,504,281 Substrate based unmolded package 7 2005
7,682,877 Substrate based unmolded package 1 2008
7,790,513 Substrate based unmolded package 0 2009
 
INFINEON TECHNOLOGIES AG (4)
7,524,699 Electronic component and a panel 0 2004
7,683,460 Module with a shielding and/or heat dissipating element 1 2006
8,350,382 Semiconductor device including electronic component coupled to a backside of a chip 0 2007
7,968,378 Electronic device 2 2008
 
SAMSUNG ELECTRONICS CO., LTD. (4)
6,857,470 Stacked chip package with heat transfer wires 15 2003
7,825,523 Semiconductor chip having bond pads 0 2006
7,615,415 Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability 1 2007
7,868,443 Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability 1 2009
 
AMKOR TECHNOLOGY, INC. (3)
6,919,631 Structures for improving heat dissipation in stacked semiconductor packages 43 2004
8,129,824 Shielding for a semiconductor package 0 2008
8,084,868 Semiconductor package with fast power-up cycle and method of making same 0 2010
 
INTEL CORPORATION (3)
7,030,488 Packaged combination memory for electronic devices 6 2001
7,465,605 In-situ functionalization of carbon nanotubes 5 2005
7,932,596 Thermally enhanced electronic flip-chip packaging with external-connector-side die and method 0 2008
 
KABUSHIKI KAISHA TOSHIBA (2)
7,871,856 Method and apparatus for manufacturing stacked-type semiconductor device 0 2005
8,022,515 Semiconductor device 0 2008
 
SEIKO EPSON CORPORATION (2)
7,320,902 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument 0 2004
7,611,925 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument 0 2007
 
ADVANCE SEMICONDUCTOR ENGINEERING INC. (1)
6,921,968 Stacked flip chip package 41 2004
 
ATI TECHNOLOGIES ULC (1)
8,120,170 Integrated package circuit with stiffener 1 2008
 
CHIP PAC, INC. (1)
7,163,842 Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) 22 2006
 
FREESCALE SEMICONDUCTOR, INC. (1)
7,479,407 Digital and RF system and method therefor 4 2002
 
INTEL MOBILE COMMUNICATIONS GMBH (1)
7,883,993 Semiconductor device with semiconductor chip and rewiring layer and method for producing the same 2 2006
 
NXP B.V. (1)
7,961,478 Integrated circuit, and a mobile phone having the integrated circuit 0 2005
 
PANASONIC ELECTRIC WORKS CO., LTD. (1)
7,057,277 Chip package structure 17 2004
 
SANYO ELECTRIC CO., LTD. (1)
7,453,153 Circuit device 1 2006
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (1)
7,598,123 Semiconductor component and method of manufacture 0 2007
 
SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY (1)
7,545,026 Electronic device comprising an integrated circuit 6 2005
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
7,655,504 Semiconductor device and method of manufacturing the same 3 2008
 
ST ASSEMBLY TEST SERVICES LTD. (1)
7,205,651 Thermally enhanced stacked die package and fabrication method 14 2004
 
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (1)
7,217,997 Ground arch for wirebond ball grid arrays 9 2004
 
UTAC - UNITED TEST AND ASSEMBLY TEST CENTER LTD. (1)
7,851,899 Multi-chip ball grid array package and method of manufacture 1 2004

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