Substrate and method of forming substrate for MEMS device with strain gage
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United States of America Patent
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May 25, 2004
Grant Date -
N/A
app pub date -
Mar 10, 2003
filing date -
Mar 10, 2003
priority date (Note) -
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Abstract
A substrate for a MEMS device includes a base material having a first side, a poly silicon strain gage formed on the first side of the base material, a dielectric material disposed over the strain gage, and a conductive material in communication with the strain gage through the dielectric material, wherein the substrate is adapted to have at least one opening formed therethrough, and wherein the strain gage is adapted to be formed adjacent the at least one opening.
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