Method of delivering target object to be processed, table mechanism of target object and probe apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6739208
APP PUB NO 20020044864A1
SERIAL NO

09932930

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In the present invention, a main chuck comprises a table for performing the delivery of a wafer W to and from a pincette and a plurality of lift pins for allowing the wafer W to rise from the surface of the table. At least one lift pin positioned on the side of the pincette is made longer and positioned higher than the other lift pins so as to permit the wafer W to be supported above the table in an inclined manner.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hyakudomi, Takanori Nirasaki, JP 9 73

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