Desiccants and desiccant packages for highly moisture-sensitive electronic devices
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United States of America Patent
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May 25, 2004
Grant Date -
Feb 27, 2003
app pub date -
Aug 8, 2001
filing date -
Aug 8, 2001
priority date (Note) -
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Abstract
An effective desiccant for use in a package which has a material including at least in part solid particles of one or more materials, at least one of such materials having an average particle size range 0.001 to 0.1 micrometers to provide a high rate of water absorption and to provide an equilibrium minimum humidity level lower than a humidity level to which a highly moisture sensitive electronic device is sensitive within a sealed enclosure.
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