Importance

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Abstract

Stiffeners for tapes, films, or other connective structures that are configured to be secured to a semiconductor device component, such as a semiconductor die or substrate, by tape-automated bonding processes. The stiffeners are fabricated by stereolithographic processes and may include one layer or two or more superimposed, contiguous, mutually adhered layers. The stiffeners are configured to prevent torsional flexion or bending of the connective structure to which they are to be secured. The stiffeners may include apertures through which intermediate conductive elements or other structures secured to the connective structure may be exposed or protrude. Stiffeners that reinforce sprocket or indexing holes in a connective structures are also disclosed. The stereolithographic method of fabricating the stiffeners may include use of a machine vision system with at least one camera operably associated with a computer that controls the stereolithographic application of material so that the system may recognize the position and orientation of one or more connective structures on which at least an element of each of the stiffeners is to be fabricated.

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First Claim