Surface mount socket contact providing uniform solder ball loading and method
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United States of America Patent
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-
Jun 1, 2004
Grant Date -
Oct 30, 2003
app pub date -
Apr 24, 2002
filing date -
Apr 24, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A surface mount contact to provide uniform reflow element (e.g. solder ball) loading, a method to accomplish the same, and a system embodying the same. The surface mount socket can include at least one contact with an upper end, an intermediate section and a lower end. The upper end is adapted to receive an electrical contact. The intermediate section is adapted to flex under compressive load. The lower end is adapted to accommodate a preformed reflow element.
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