Adhesiveless transfer lamination method and materials for producing electronic circuits
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United States of America Patent
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-
Jun 1, 2004
Grant Date -
Apr 17, 2003
app pub date -
Oct 4, 2002
filing date -
Sep 30, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An electronic circuit is made by printing a Parmod.RTM. composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configuration. The conductor can also be coated with a polymer and cured to form a prepatterned substrate. Single and double-sided circuits or multilayers can be made this way.
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