Method of spin etching wafers with an alkali solution

United States of America Patent

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Jun 1, 2004
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Jul 31, 2003
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Jan 29, 2002
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Jan 29, 2002

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Abstract

A method of relieving surface stress on a thin wafer by removing a small portion of the wafer substrate, the substrate being removed by applying a solution of KOH to the wafer while the wafer spins.

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REVASUM, INC.;STRASBAUGH

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Kassir, Salman M	San Luis Obispo, CA	9	120

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Method of spin etching wafers with an alkali solution

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10059701

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PATENT NO	6743722
APP PUB NO	20030143861A1
SERIAL NO	10059701
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 01, 2004	US,6743722,B2 US6743722B2	GRANTED PATENT AS SECOND PUBLICATION
July 31, 2003	US,20030143861,A1 US20030143861A1	FIRST PUBLISHED PATENT APPLICATION

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