Planarization process for semiconductor substrates
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United States of America Patent
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Jun 1, 2004
Grant Date -
Dec 13, 2001
app pub date -
Apr 11, 2001
filing date -
May 23, 1997
priority date (Note) -
Expired
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Abstract
A method of manufacturing semiconductor devices using an improved chemical mechanical planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved chemical mechanical planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer filling in between the surface irregularities prior to the planarization of the surface through a chemical mechanical planarization process.
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