Heat processing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6744020
APP PUB NO 20020086259A1
SERIAL NO

10028789

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A heat processing apparatus comprises a hot plate for putting the substrate on or near its surface, a ceiling with a first and second concentric regions with a first and second heat pipes, respectively, opposite to the hot plate surface, a member surrounding a space between the hot plate and the ceiling, a gas flow generator supplying gas to the a region from a circumference of the hot plate to a center of the ceiling, and a temperature control mechanism for controlling a regional temperature of the first region in such a manner that a heat emission is greater from a center of the substrate than from a circumference of the substrate, thus heating a substrate to a uniform temperature all over its surface.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITED3-1 AKASAKA 5-CHOME MINATO-KU TOKYO 1076325 ?1076325

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuoka, Tetsuo Kikuchi-gun, JP 21 192
Nogami, Tsuyoshi Kikuchi-gun, JP 4 39
Shirakawa, Eiichi Kikuchi-gun, JP 24 600

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