Frame for semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jun 1, 2004
Grant Date -
Nov 22, 2001
app pub date -
May 7, 2001
filing date -
May 9, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A frame for a semiconductor package includes plural lead frames arranged through grid-leads in a matrix. Semiconductor devices are mounted on individual lead frames of the frame, and are molded with molding compound. Thereafter, the molded semiconductor devices are cut at grid-leads by means of a dicing saw so that individual semiconductor packages are obtained. The frame further has groove portions which are formed by etching the frame from the front or back at areas corresponding to grid-leads, so that the grid-leads are made thin which reduces burrs and the generation of metal powders and dust.
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