Use of a reference fiducial on a semiconductor package to monitor and control a singulation method
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United States of America Patent
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Jun 1, 2004
Grant Date -
May 16, 2002
app pub date -
Jan 4, 2002
filing date -
Aug 31, 2000
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor package singulation process is disclosed. The process comprises the step of using at least a portion of a reference fiducial formed on at least one package in a semiconductor package panel comprising a plurality of interconnected packages, the fiducial used to monitor and to control the semiconductor package singulation process.
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