Semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6744139
APP PUB NO 20030127678A1
SERIAL NO

10237011

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device is provided which is capable of reducing the number of masking processes in forming contact holes. The semiconductor device comprises a semiconductor substrate (1), a gate structure (9), a stopper film (11), an interlayer insulation film (12), a contact hole (17) extending from the upper surface (13) of the interlayer insulation film (12) to the semiconductor substrate (1), a metal material (18) buried in the contact hole (17), a first metal wiring layer (19), an interlayer insulation film (20), a contact hole (23) extending from the upper surface (21) of the interlayer insulation film (20) to the first metal wiring layer (19), and a contact hole (24) extending from the upper surface (21) of the interlayer insulation film (20) to a gate electrode (7) of the gate structure (9). The contact hole (24) is formed at the same time as the contact hole (23).

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Patent Owner(s)

  • RENESAS TECHNOLOGY CORP.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shimizu, Ippei Tokyo, JP 32 311
Shimizu, Shu Tokyo, JP 19 146

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