Burn-in board with adaptable heat sink device
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United States of America Patent
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Jun 1, 2004
Grant Date -
N/A
app pub date -
Oct 6, 1998
filing date -
Oct 7, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A system and method for burning-in an integrated circuit comprises a socket capable of receiving and supporting the IC, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. A first thermal interface provides releasable thermal contact between the integrated circuit in the socket and a resiliently mounted heat absorbing member. A second thermal interface is provided between the heat absorbing member and the heat sink.
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