Board-level EMI shield with enhanced thermal dissipation
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United States of America Patent
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Jun 1, 2004
Grant Date -
Oct 16, 2003
app pub date -
Apr 10, 2002
filing date -
Apr 10, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A substrate having at least one electrical component disposed thereon; a plurality of discrete electrically conductive fastening units disposed in a pattern on the substrate surrounding the at least one electrical component; a board-level electromagnetic interference (EMI) shield comprising an electrically conductive layer; a plurality of apertures formed in the board-level EMI shield such that the apertures correspond to the pattern of the electrically conductive fastening units; with at least one thermally conductive interface (TCI) material disposed over the at least one electrical component; and wherein the electrically conductive layer of the board-level EMI shield is in electrical contact with at least one electrically conductive fastening unit.
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