Removable film, a substrate with film, a process for forming the removable film and a process for the manufacturing of the circuit board
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United States of America Patent
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Jun 8, 2004
Grant Date -
Oct 9, 2003
app pub date -
Mar 31, 2003
filing date -
Dec 16, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Removable mask films 303 are formed on the both sides of the substrate having the adhesive layer 302 by applying and drying a resin varnish 304 including a ultraviolet-absorbing agent, and fine through holes 306 are formed by using a third harmonics YAG solid-state laser light with a relatively short wavelength not longer than that in the ultraviolet range in such a way that the effects of such a residual strain as the conventional embodiment forming a removable mask film by a laminating process may be decreased as well as the more fine hole drilling compared with conventional embodiment using the carbon dioxide gas laser with a relatively long wavelength may be performed.
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