Method and apparatus for the production and quality testing of a bonded wire connection
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United States of America Patent
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Jun 8, 2004
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app pub date -
May 31, 2002
filing date -
Mar 8, 2002
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Abstract
A method of producing a bonded wire connection between an electronic component or a subassembly and a carrier by introducing energy from an ultrasound transducer into a wire that is to be bonded. According to this method, during the introduction of energy the impedance of the ultrasound transducer is measured as a function of time. The shape of the curve representing this time dependence is evaluated on the basis of a pre-specified comparison criteria, and the power input to the ultrasound transducer and/or a bond weight exerted on the wire is/are controlled in dependence on the result of this evaluation. A device usable for carrying out this method is also described.
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