Use of polyimide for adhesive layers, lithographic method for producing microcomponents and method for producing composite material
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United States of America Patent
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Jun 8, 2004
Grant Date -
N/A
app pub date -
Aug 5, 2002
filing date -
Nov 19, 1999
priority date (Note) -
Expired
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Abstract
The invention relates to a lithographic method for producing microcomponents with component structures in the submillimeter range. According to the inventive method, a structured adhesive layer is applied to a metal layer and then a photostructured epoxy resin layer is applied to said adhesive layer. Said epoxide resin is structured by means of selective exposition and removing the unexposed zones and filling in the gaps between the resin structures with metal by electroplating. The aim of the invention is to provide an adhesive layer that is suitable for photostructured epoxy resins, especially for SU-8 resist material and that prevents the resist material from being detached. To this end, the adhesive layer consists of polyimide or a polyimide mixture.
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