Integrated circuit having multiple power/ground connections to a single external terminal
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United States of America Patent
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Jun 8, 2004
Grant Date -
N/A
app pub date -
Aug 19, 2002
filing date -
Aug 19, 2002
priority date (Note) -
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status (Latency Note)
Importance
Abstract
An integrated circuit having multiple power/ground connections to a single external terminal and method for manufacturing an integrated circuit provides an integrated circuit having a reduced number of external power/ground terminals. The multiple connections may be made by conductive circuit paths on one side of the substrate and a terminal pad on the same side of the substrate, with the conductive circuit paths leading from die terminals terminating at the terminal pad, or a via may be formed either directly above the terminal pad or contacting its circumference to provide a connection through from the opposite side of the substrate. Multiple vias may be formed above the terminal pad and within its circumference to provide connection of multiple die terminals to the terminal pad.
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