Heat sink for electronic components
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United States of America Patent
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-
Jun 8, 2004
Grant Date -
Dec 26, 2002
app pub date -
Apr 12, 2002
filing date -
Apr 27, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat sink for electronic components having a heat dissipator connected to at least one electronic component and a ventilator designed to supply the heat dissipator with air. The heat dissipator includes at least one thermally conductive plate connected to the electronic component and having a plurality of openings.
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