Memory module having buffer for isolating stacked memory devices
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United States of America Patent
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Jun 8, 2004
Grant Date -
Feb 20, 2003
app pub date -
Oct 2, 2002
filing date -
Sep 18, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention utilizes a buffer to isolate a stack of memory devices, thereby taking advantage of the increased memory density available from stacked memory devices while reducing capacitive loading. A memory module in accordance with the present invention may include a stack of memory devices and a buffer coupled to the first and second memory devices and arranged to capacitively isolate the first and second memory devices from a bus. In a memory system in accordance with the present invention, multiple buffered stacks of memory devices are preferably coupled in a point-to-point arrangement, thereby further reducing capacitive loading.
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