Method to compensate for stress between heat spreader and thermal interface material
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United States of America Patent
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Jun 8, 2004
Grant Date -
Mar 27, 2003
app pub date -
Sep 27, 2001
filing date -
Sep 27, 2001
priority date (Note) -
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Abstract
A device and method identify and compensate for tensile and/or shear stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This device and method may change the shape of the integrated heat spreader based upon the identification of location(s) of high tensile and/or shear stress so that additional thermal interface material may be deposited between the integrated heat spreader and a die in corresponding locations. Utilizing this method and device, heat is efficiently transferred from the die to the integrated heat spreader.
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