Heat spreader hole pin 1 identifier

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United States of America Patent

PATENT NO 6750534
SERIAL NO

10099284

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A new method is provided to identify semiconductor devices whereby the invention provides for a shallow depression on the backside of the heat sink of the ball grid array package. This shallow depression or hole can be used for visual and optical inspection of the device orientation.

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Patent Owner(s)

Patent OwnerAddress
STATS CHIPPAC PTE LTD5 YISHUN STREET 23 SINGAPORE

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aquien, Weddie Pacio Singapore, SG 3 14
Cantillep, Loreto Y Singapore, SG 3 59
Fee, Setho Sing Singapore, SG 31 1516

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