Current supply and support system for a thin package
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United States of America Patent
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Jun 15, 2004
Grant Date -
Jun 19, 2003
app pub date -
Dec 14, 2001
filing date -
Dec 14, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An electronic package that includes an interposer, a die and laminated conductor. The die and laminated conductor are secured to the interposer such that the laminated conductor mechanically supports the interposer and supplies current to the die.
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