Joining semiconductor units with bonding material
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United States of America Patent
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Jun 15, 2004
Grant Date -
Jul 24, 2003
app pub date -
Oct 23, 2002
filing date -
Mar 10, 1999
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A unit includes one or more semiconductor chips. Each chip has a front surface with a plurality of contacts surrounded by a passivated surface. The passivated surface is not wettable by bonding material. The contacts have masses of bonding material thereon and the masses have a height less than the diameter of the contacts.
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