Embossing methods
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United States of America Patent
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Jun 22, 2004
Grant Date -
Feb 28, 2002
app pub date -
May 1, 2001
filing date -
Feb 12, 1999
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In one embodiment, the method far embossing a substrate, includes: heating a first substrate to a temperature above a glass transition temperature; preheating and maintaining a mold at a mold temperature below the glass transition temperature; introducing the heated substrate to the preheated mold; compressing the heated substrate in the mold; cooling the compressed substrate; and removing the cooled substrate from the mold. In another embodiment, the method for embossing a substrate, includes: heating a first substrate to a temperature above a substrate surface glass transition temperature; preheating a mold to a mold temperature of up to about 30.degree. C. above the substrate surface glass transition temperature; introducing the heated substrate to the preheated mold; compressing the heated substrate in the mold; cooling the compressed substrate; and removing the cooled substrate from the mold.
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