Heat activated adhesive
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United States of America Patent
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-
Jun 22, 2004
Grant Date -
N/A
app pub date -
Apr 19, 2002
filing date -
Nov 5, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides thermally activated adhesive compositions comprising polymer and polyester wherein the adhesive polymer comprises a polymer having hydroxyl and phenyl groups and adhesive films made from the adhesive compositions.
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