Power supply structure for high density servers

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United States of America Patent

PATENT NO 6754087
SERIAL NO

10352939

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A power supply structure for high density servers bridging a system end and a power supply end includes a power receiving unit located on the system end, a power transmission unit located on the power supply end, and a conductive connection element connecting the power receiving unit and the power transmission unit through fasteners. The conductive connection element establishes electric connection with the power receiving unit and the power transmission unit through the fasteners so that power supply provided by the power supply end is transmitted from the power transmission unit to the conductive connection element which in turn transmits the power to the system end through the power receiving unit. The power supply structure of the invention may be assembled and installed quickly.

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Patent Owner(s)

Patent OwnerAddress
SHIN JIUH CORPORATION10F NO 50 MIN-CHUAN RD HSIN-TIEN CITY TAIPEI HSIEN TAIWAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Tzung-Han Hsin-Tien, TW 135 609
Sung, Edy Hsin-Tien, TW 1 2

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