Moisture curable compounds and compositions
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United States of America Patent
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Jun 29, 2004
Grant Date -
N/A
app pub date -
Oct 19, 2001
filing date -
Oct 19, 2001
priority date (Note) -
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Abstract
A moisture curable compound for bonding substrates and a moisture curable adhesive composition are provided. The adhesive composition includes an alkoxysilane functional urethane compound having hydrolyzable alkoxysilane groups anchored on a flexible backbone. Also provided are processes for the preparation of the moisture curable compounds and a method of using them as moisture curable adhesives for bonding substrates to produce bonded composites.
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