Electronic device and its manufacturing method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jun 29, 2004
Issued Date -
N/A
app pub date -
Oct 30, 2000
filing date -
Aug 26, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.
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