Molded shield structures and method for their fabrication
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United States of America Patent
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Jun 29, 2004
Grant Date -
N/A
app pub date -
Aug 22, 2000
filing date -
Aug 22, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Molded shield structures and method for their fabrication are disclosed. According to one embodiment, a die is attached to a printed circuit board, for example, by using a die attach epoxy. Thereafter, at least one post is attached to the printed circuit board adjacent to the die. The at least one post can be, for example, made of copper or solder-coated ceramic. A shield is then mounted on the at least one post. The shield encloses an area on the printed circuit board which includes the die and may include additional elements, such as passive devices. The shield can be, for example, made of stainless steel, copper, or a copper alloy. In one embodiment, the shield is a wire mesh which can be made of copper or aluminum. After mounting the shield, a molding compound is used to encapsulate the shield, the at least one post, the die, and any additional elements, such as passive devices, that are enclosed by the shield.
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