High speed pick and place apparatus
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United States of America Patent
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Jul 6, 2004
Grant Date -
Jan 16, 2003
app pub date -
Jul 10, 2001
filing date -
Jul 10, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A pick and place apparatus comprises a bond arm adapted for rotation about an axis between a pick location and a place location. The bond arm is formed with a cavity at an end of the arm remote from the axis, within which cavity are located a plurality of damping particles for damping unwanted vibrations of the bond arm. The particles may be irregular tungsten granules with a diameter between 0.3 and 1.2 mm and a filling ratio of about 75%.
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