Heat dissipating component using high conducting inserts
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United States of America Patent
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Jul 6, 2004
Grant Date -
Jun 26, 2003
app pub date -
Dec 13, 2001
filing date -
Dec 13, 2001
priority date (Note) -
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Abstract
A thermal management system provides a heat dissipating component using a high thermal conductivity insert. The heat dissipating component may be a spreader or heat sink, and includes a planar graphite member having high thermal conductivity along the plane of the member and having a relatively low thermal conductivity through the thickness of the member. A cavity is formed through the thickness of the member and the high conductivity insert is received in the cavity. The insert may be an isotropic high thermal conductivity material such as copper or an anisotropic material such as graphite oriented to have high conductivity in the direction of the thickness of the planar element.
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