Fan out of interconnect elements attached to semiconductor wafer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jul 6, 2004
Grant Date -
May 1, 2003
app pub date -
Oct 31, 2001
filing date -
Oct 31, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An unsingulated semiconductor wafer is provided. Electrical interconnect elements are formed on the unsingulated wafer such that the interconnect elements are electrically connected to terminals of the semiconductor dice composing the wafer. At least a portion of the interconnect elements extend beyond the boundaries of the dice into the scribe streets separating the individual dice. Thereafter, the wafer is singulated into individual dice.
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