Multilayered substrate for semiconductor device
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United States of America Patent
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Jul 6, 2004
Grant Date -
May 1, 2003
app pub date -
Oct 28, 2002
filing date -
Oct 31, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.
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