Resilient and rugged multi-layered probe
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United States of America Patent
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Jul 6, 2004
Grant Date -
Jun 19, 2003
app pub date -
Dec 19, 2001
filing date -
Dec 19, 2001
priority date (Note) -
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Abstract
A resilient and rugged probe, used to measure an on-wafer signal. The probe has a metal probe tip, a resilient soft multi-layered dielectric substrate, a planar transmission structure and a fixed end. The probe tip is connected to the planar transmission structure. The planar transmission structure is attached to and supported by the resilient soft multi-layered dielectric substrate and then connected to the fixed end.
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