Wireless radio frequency technique design and method for testing of integrated circuits and wafers
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United States of America Patent
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Jul 6, 2004
Grant Date -
Aug 7, 2003
app pub date -
May 15, 2001
filing date -
May 15, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is for an apparatus and method for the wireless testing of Integrated Circuits and wafers. The apparatus comprises a test unit external from the wafer and at least one test circuit which is fabricated on the wafer which contains the Integrated Circuit. The test unit transmits an RF signal to power the test circuit. The test circuit, comprising a variable ring oscillator, performs a series of parametric tests at the normal operating frequency of the Integrated Circuit and transmits the test results to the test unit for analysis.
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