Heat-dissipating structure of circuit board
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United States of America Patent
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-
Jul 6, 2004
Grant Date -
N/A
app pub date -
Mar 25, 2003
filing date -
Jan 20, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A heat-dissipating circuit board assembly is composed of a heat-conducting base board and a circuit board. The heat-conducting base board includes an insulating heat-conducting layer disposed thereon and a plurality of bonding pads disposed on the insulating heat-conducting layer and never connected with one another. The circuit board that is single-layered or multiple-layered includes a plurality of electronic components at at least one side thereof and a plurality of heat-dissipating zones at a side thereof. The heat-dissipating zones are connected with heat-generating elements of the electronic components and in a corresponding position to the bonding pads. The heat-conducting base board is connected with the heat-conducting base board by the melted bonding pads that are melted by heating and further disposed therebetween.
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